IC card module bending stress durability testing machine
A device for conducting stress durability tests on the bending characteristics of the IC module section of IC cards. Providing IC cards that withstand bending to the market!
This is a device that conducts stress durability tests specifically focused on the bending characteristics of IC card module parts. It has an automatic stop function that activates when the set number of cycles is reached. It provides peace of mind with IC cards used as security cards, which can withstand the bonding strength of the IC module and disconnection failures with the card antenna. As a safety mechanism, it employs an emergency stop switch and an interlock cover. Customization of the testing machine is also possible. 【Features】 - Capable of conducting stress durability tests on the bending characteristics of IC cards - Enhances the safety of IC cards used as security cards - Customization of the testing machine is available *For more details, please contact us or download the PDF.
- Company：テストラム
- Price：1 million yen-5 million yen
